Copper Bond Polishing Pads - FY
Description
The FY series copper bond diamond tooling is a matrix of high quality abrasive diamonds bonded with a proprietary mix of various metals and resins designed for long life, exceptional durability, high flexibility and incomparable scratch removal.
The Hybrids are designed for wet or dry applications and the face design provides excellent channeling for dust or slurry. The consistency of performance is outstanding. The manufacturing process ensures even distribution of abrasives through the resin adding to the longevity and performance of the tooling.
Uses
The FY Series is an excellent transitional diamond generally used between aggressive metal tooling and higher grit resin bond tools. These Hybrid tools are unsurpassed in scratch removal usually caused by aggressive metals commonly used in the first few steps of the grinding process.
Application
The FY series of Hybrid is an ideal tool on concrete and terrazzo surfaces or natural stone surfaces. The variety of sizes available provides the ideal tool for grinding, refining and polishing floors and edges, countertops and architectural accessories.
